# | Title | Journal | Year | Citations |
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1 | Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials | Journal of Electronic Packaging, Transactions of the ASME | 2016 | 328 |
2 | Buoyancy-Induced Flows and Transport | Journal of Electronic Packaging, Transactions of the ASME | 1989 | 317 |
3 | Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction | Journal of Electronic Packaging, Transactions of the ASME | 2002 | 289 |
4 | Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys | Journal of Electronic Packaging, Transactions of the ASME | 2001 | 265 |
5 | Two-Phase Microchannel Heat Sinks: Theory, Applications, and Limitations | Journal of Electronic Packaging, Transactions of the ASME | 2011 | 255 |
6 | Review of Heat Transfer Technologies in Electronic Equipment | Journal of Electronic Packaging, Transactions of the ASME | 1995 | 216 |
7 | Finned Metal Foam Heat Sinks for Electronics Cooling in Forced Convection | Journal of Electronic Packaging, Transactions of the ASME | 2002 | 216 |
8 | A Thermodynamic Framework for Damage Mechanics of Solder Joints | Journal of Electronic Packaging, Transactions of the ASME | 1998 | 201 |
9 | Thermal Spreading Resistance of Eccentric Heat Sources on Rectangular Flux Channels | Journal of Electronic Packaging, Transactions of the ASME | 2003 | 194 |
10 | Optimal Thermal Design of Forced Convection Heat Sinks-Analytical | Journal of Electronic Packaging, Transactions of the ASME | 1991 | 189 |
11 | Piezoresistive Stress Sensors for Structural Analysis of Electronic Packages | Journal of Electronic Packaging, Transactions of the ASME | 1991 | 184 |
12 | Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach | Journal of Electronic Packaging, Transactions of the ASME | 1992 | 183 |
13 | Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy | Journal of Electronic Packaging, Transactions of the ASME | 1999 | 145 |
14 | Quantum Dots-Converted Light-Emitting Diodes Packaging for Lighting and Display: Status and Perspectives | Journal of Electronic Packaging, Transactions of the ASME | 2016 | 144 |
15 | Design of Optimum Plate-Fin Natural Convective Heat Sinks | Journal of Electronic Packaging, Transactions of the ASME | 2003 | 137 |
16 | Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronic Components | Journal of Electronic Packaging, Transactions of the ASME | 2004 | 136 |
17 | Transport Phenomena in Two-Phase Micro-Channel Heat Sinks | Journal of Electronic Packaging, Transactions of the ASME | 2004 | 134 |
18 | Principles of Electronic Packaging | Journal of Electronic Packaging, Transactions of the ASME | 1989 | 133 |
19 | Design and Thermal Characteristics of a Synthetic Jet Ejector Heat Sink | Journal of Electronic Packaging, Transactions of the ASME | 2005 | 123 |
20 | Review and Projections of Integrated Cooling Systems for Three-Dimensional Integrated Circuits | Journal of Electronic Packaging, Transactions of the ASME | 2014 | 118 |
21 | Microscale and Nanoscale Thermal Characterization Techniques | Journal of Electronic Packaging, Transactions of the ASME | 2008 | 111 |
22 | Thermal Deformation Analysis of Various Electronic Packaging Products by Moire´ and Microscopic Moire´ Interferometry | Journal of Electronic Packaging, Transactions of the ASME | 1995 | 110 |
23 | Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study | Journal of Electronic Packaging, Transactions of the ASME | 2016 | 108 |
24 | Thermal Stresses in Layered Electronic Assemblies | Journal of Electronic Packaging, Transactions of the ASME | 1997 | 106 |
25 | Comparison of Two-Phase Electronic Cooling Using Free Jets and Sprays | Journal of Electronic Packaging, Transactions of the ASME | 1995 | 104 |
26 | A Simplified Conduction Based Modeling Scheme for Design Sensitivity Study of Thermal Solution Utilizing Heat Pipe and Vapor Chamber Technology | Journal of Electronic Packaging, Transactions of the ASME | 2003 | 103 |
27 | Parametric Investigation Into the Effects of Pressure, Subcooling, Surface Augmentation and Choice of Coolant on Pool Boiling in the Design of Cooling Systems for High-Power-Density Electronic Chips | Journal of Electronic Packaging, Transactions of the ASME | 1990 | 101 |
28 | The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging | Journal of Electronic Packaging, Transactions of the ASME | 2002 | 100 |
29 | Recent Advances and New Trends in Flip Chip Technology | Journal of Electronic Packaging, Transactions of the ASME | 2016 | 100 |
30 | Optimization of Enhanced Surfaces for High Flux Chip Cooling by Pool Boiling | Journal of Electronic Packaging, Transactions of the ASME | 1993 | 99 |
31 | An Ultra-High Power Two-Phase Jet-Impingement Avionic Clamshell Module | Journal of Electronic Packaging, Transactions of the ASME | 1996 | 99 |
32 | Metal Foam and Finned Metal Foam Heat Sinks for Electronics Cooling in Buoyancy-Induced Convection | Journal of Electronic Packaging, Transactions of the ASME | 2006 | 98 |
33 | Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink | Journal of Electronic Packaging, Transactions of the ASME | 2007 | 97 |
34 | Optimization and Design of a Multipass Branching Microchannel Heat Sink for Electronics Cooling | Journal of Electronic Packaging, Transactions of the ASME | 2012 | 97 |
35 | A Stress Singularity Parameter Approach for Evaluating the Interfacial Reliability of Plastic Encapsulated LSI Devices | Journal of Electronic Packaging, Transactions of the ASME | 1989 | 94 |
36 | Applied Probability for Engineers and Scientists | Journal of Electronic Packaging, Transactions of the ASME | 1997 | 93 |
37 | Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 2—Flow Rate and Pressure Drop Constraints | Journal of Electronic Packaging, Transactions of the ASME | 1994 | 92 |
38 | Nanothermal Interface Materials: Technology Review and Recent Results | Journal of Electronic Packaging, Transactions of the ASME | 2015 | 92 |
39 | Interfacial Shear and Peel Stresses in Multilayered Thin Stacks Subjected to Uniform Thermal Loading | Journal of Electronic Packaging, Transactions of the ASME | 1991 | 91 |
40 | Thermal Phenomena in Nanoscale Transistors | Journal of Electronic Packaging, Transactions of the ASME | 2006 | 89 |
41 | Local Heat Transfer Distributions in Confined Multiple Air Jet Impingement | Journal of Electronic Packaging, Transactions of the ASME | 2001 | 87 |
42 | Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 1—Design Criteria and Heat Diffusion Constraints | Journal of Electronic Packaging, Transactions of the ASME | 1994 | 84 |
43 | Pumpless Loop for Narrow Channel and Micro-Channel Boiling | Journal of Electronic Packaging, Transactions of the ASME | 2003 | 84 |
44 | Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration | Journal of Electronic Packaging, Transactions of the ASME | 2014 | 84 |
45 | Taguchi on Robust Technology Development: Bringing Quality Engineering Upstream | Journal of Electronic Packaging, Transactions of the ASME | 1994 | 83 |
46 | Numerical Optimization of the Thermoelectric Cooling Devices | Journal of Electronic Packaging, Transactions of the ASME | 2007 | 83 |
47 | Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes | Journal of Electronic Packaging, Transactions of the ASME | 2018 | 83 |
48 | Transient Thermal Management of a Handset Using Phase Change Material (PCM) | Journal of Electronic Packaging, Transactions of the ASME | 2002 | 82 |
49 | A Brief Overview of Recent Developments in Thermal Management in Data Centers | Journal of Electronic Packaging, Transactions of the ASME | 2015 | 82 |
50 | Thermally Conductive and Highly Electrically Resistive Grease Through Homogeneously Dispersing Liquid Metal Droplets Inside Methyl Silicone Oil | Journal of Electronic Packaging, Transactions of the ASME | 2014 | 81 |