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Top Articles

#TitleJournalYearCitations
1Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film MaterialsJournal of Electronic Packaging, Transactions of the ASME2016328
2Buoyancy-Induced Flows and TransportJournal of Electronic Packaging, Transactions of the ASME1989317
3Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life PredictionJournal of Electronic Packaging, Transactions of the ASME2002289
4Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder AlloysJournal of Electronic Packaging, Transactions of the ASME2001265
5Two-Phase Microchannel Heat Sinks: Theory, Applications, and LimitationsJournal of Electronic Packaging, Transactions of the ASME2011255
6Review of Heat Transfer Technologies in Electronic EquipmentJournal of Electronic Packaging, Transactions of the ASME1995216
7Finned Metal Foam Heat Sinks for Electronics Cooling in Forced ConvectionJournal of Electronic Packaging, Transactions of the ASME2002216
8A Thermodynamic Framework for Damage Mechanics of Solder JointsJournal of Electronic Packaging, Transactions of the ASME1998201
9Thermal Spreading Resistance of Eccentric Heat Sources on Rectangular Flux ChannelsJournal of Electronic Packaging, Transactions of the ASME2003194
10Optimal Thermal Design of Forced Convection Heat Sinks-AnalyticalJournal of Electronic Packaging, Transactions of the ASME1991189
11Piezoresistive Stress Sensors for Structural Analysis of Electronic PackagesJournal of Electronic Packaging, Transactions of the ASME1991184
12Solder Creep-Fatigue Analysis by an Energy-Partitioning ApproachJournal of Electronic Packaging, Transactions of the ASME1992183
13Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder AlloyJournal of Electronic Packaging, Transactions of the ASME1999145
14Quantum Dots-Converted Light-Emitting Diodes Packaging for Lighting and Display: Status and PerspectivesJournal of Electronic Packaging, Transactions of the ASME2016144
15Design of Optimum Plate-Fin Natural Convective Heat SinksJournal of Electronic Packaging, Transactions of the ASME2003137
16Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronic ComponentsJournal of Electronic Packaging, Transactions of the ASME2004136
17Transport Phenomena in Two-Phase Micro-Channel Heat SinksJournal of Electronic Packaging, Transactions of the ASME2004134
18Principles of Electronic PackagingJournal of Electronic Packaging, Transactions of the ASME1989133
19Design and Thermal Characteristics of a Synthetic Jet Ejector Heat SinkJournal of Electronic Packaging, Transactions of the ASME2005123
20Review and Projections of Integrated Cooling Systems for Three-Dimensional Integrated CircuitsJournal of Electronic Packaging, Transactions of the ASME2014118
21Microscale and Nanoscale Thermal Characterization TechniquesJournal of Electronic Packaging, Transactions of the ASME2008111
22Thermal Deformation Analysis of Various Electronic Packaging Products by Moire´ and Microscopic Moire´ InterferometryJournal of Electronic Packaging, Transactions of the ASME1995110
23Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape StudyJournal of Electronic Packaging, Transactions of the ASME2016108
24Thermal Stresses in Layered Electronic AssembliesJournal of Electronic Packaging, Transactions of the ASME1997106
25Comparison of Two-Phase Electronic Cooling Using Free Jets and SpraysJournal of Electronic Packaging, Transactions of the ASME1995104
26A Simplified Conduction Based Modeling Scheme for Design Sensitivity Study of Thermal Solution Utilizing Heat Pipe and Vapor Chamber TechnologyJournal of Electronic Packaging, Transactions of the ASME2003103
27Parametric Investigation Into the Effects of Pressure, Subcooling, Surface Augmentation and Choice of Coolant on Pool Boiling in the Design of Cooling Systems for High-Power-Density Electronic ChipsJournal of Electronic Packaging, Transactions of the ASME1990101
28The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic PackagingJournal of Electronic Packaging, Transactions of the ASME2002100
29Recent Advances and New Trends in Flip Chip TechnologyJournal of Electronic Packaging, Transactions of the ASME2016100
30Optimization of Enhanced Surfaces for High Flux Chip Cooling by Pool BoilingJournal of Electronic Packaging, Transactions of the ASME199399
31An Ultra-High Power Two-Phase Jet-Impingement Avionic Clamshell ModuleJournal of Electronic Packaging, Transactions of the ASME199699
32Metal Foam and Finned Metal Foam Heat Sinks for Electronics Cooling in Buoyancy-Induced ConvectionJournal of Electronic Packaging, Transactions of the ASME200698
33Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat SinkJournal of Electronic Packaging, Transactions of the ASME200797
34Optimization and Design of a Multipass Branching Microchannel Heat Sink for Electronics CoolingJournal of Electronic Packaging, Transactions of the ASME201297
35A Stress Singularity Parameter Approach for Evaluating the Interfacial Reliability of Plastic Encapsulated LSI DevicesJournal of Electronic Packaging, Transactions of the ASME198994
36Applied Probability for Engineers and ScientistsJournal of Electronic Packaging, Transactions of the ASME199793
37Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 2—Flow Rate and Pressure Drop ConstraintsJournal of Electronic Packaging, Transactions of the ASME199492
38Nanothermal Interface Materials: Technology Review and Recent ResultsJournal of Electronic Packaging, Transactions of the ASME201592
39Interfacial Shear and Peel Stresses in Multilayered Thin Stacks Subjected to Uniform Thermal LoadingJournal of Electronic Packaging, Transactions of the ASME199191
40Thermal Phenomena in Nanoscale TransistorsJournal of Electronic Packaging, Transactions of the ASME200689
41Local Heat Transfer Distributions in Confined Multiple Air Jet ImpingementJournal of Electronic Packaging, Transactions of the ASME200187
42Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 1—Design Criteria and Heat Diffusion ConstraintsJournal of Electronic Packaging, Transactions of the ASME199484
43Pumpless Loop for Narrow Channel and Micro-Channel BoilingJournal of Electronic Packaging, Transactions of the ASME200384
44Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit IntegrationJournal of Electronic Packaging, Transactions of the ASME201484
45Taguchi on Robust Technology Development: Bringing Quality Engineering UpstreamJournal of Electronic Packaging, Transactions of the ASME199483
46Numerical Optimization of the Thermoelectric Cooling DevicesJournal of Electronic Packaging, Transactions of the ASME200783
47Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction PurposesJournal of Electronic Packaging, Transactions of the ASME201883
48Transient Thermal Management of a Handset Using Phase Change Material (PCM)Journal of Electronic Packaging, Transactions of the ASME200282
49A Brief Overview of Recent Developments in Thermal Management in Data CentersJournal of Electronic Packaging, Transactions of the ASME201582
50Thermally Conductive and Highly Electrically Resistive Grease Through Homogeneously Dispersing Liquid Metal Droplets Inside Methyl Silicone OilJournal of Electronic Packaging, Transactions of the ASME201481